Job Description

The Failure Analysis lead engineer will collaborate primarily with internal customers in the optical transceivers business segment. You will serve as the resident expert in root cause analysis techniques for a wide range of microelectronics devices, leading the failure analysis team. You will also help the functional manager oversee the failure analysis laboratory, developing and maintaining a broad range of failure analysis techniques, processes and equipment.

Essential Functions/Responsibilities

• Provide technical expertise in root cause failure analysis to cross-functional project teams from Engineering (Design, Product, Process, Test and Reliability), Manufacturing and Quality across the entire new product introduction lifecycle.
• Mentor team of Failure Analysis engineer, technicians, and Co-Ops. Work with team manager to prioritize team activities.
• Determine analysis test plans, evaluations, and data analysis to identify failure modes and mechanisms. Contribute to identifying solutions and improvements based on a strong knowledge of the product’s design and assembly processes.
• Develop and implement specific requirements for improving existing PFA as well as developing new internal techniques and relationships with external labs as necessary
• Provide technical leadership and training on the use of the systems for accurate and repeatable analysis. Ensures failure analysis team and laboratory personnel implement proper maintenance and calibration of equipment.
• Investigates, recommends, and purchases new measurement, failure analysis, and inspection systems based upon ROI and throughput requirements
• Guide production improvements based on failure mechanisms
• This position may involve hands-on cleanroom work to make real-time observations
• Must be able to work independently but will be required to interact with colleagues, customers, and vendors to achieve objectives

Required Experience

• Minimum 10 years’ experience in physical failure analysis or related field
• Candidates must understand statistics, process control and reliability standards (Telcordia, JEDEC, MIL)
• Demonstrated hands on experience in physical failure analysis is required as is an understanding of the equipment and materials that are used in the industry. This includes cross sectioning, SEM, Optical Microscopes, Electrical Testing, X-Ray, CSAM.
• Experience in microelectronic / microsystem package design and construction is desired, as well as in failure modes associated with bonding techniques such as epoxies and solders.
• Expertise in minitab/SAS-JMP/similar data analysis package is desired.
• Must possess great Communication skills as this person will have interaction with upper management on a daily basis.
• Must be able to handle multiple projects at the same time and be able to change priorities on a moment’s notice.

Preferred Education

BS or greater in Engineering, Materials, or the Physical Sciences or similar field.

Training required

On the job training as appropriate.

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